Waferpedia

Comparison ledger

20 36 SurfaceversusDGP 8761 + DFM 2800 In-Line

Blanchard 20 36 Surface, Disco DGP 8761 + DFM 2800 In-Line, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
20 36 SurfaceBlanchard
OEMBlanchardDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 20 36 SurfaceDisco DGP 8761
Specifications
ConfigurationWith new Elecro-Matic Neutrol II Magnetic Chuck Control[1]Fully Automatic[2]
Magnetic Chuck ControlElectro-Matic Neutrol II[1]—
Make—Disco[2]
Model—DGP 8761 + DFM 2800 In-Line[2]
Machine type—In-Line Grinder[2]
Automation—Fully automatic[2]
Axis—3 Axis[2]
Chuck table—200 mm/300 mm universal (orientation flat)[2]
Spinner table—200 mm/300 mm universal (orientation flat)[2]
Robot pick—Inline dedicated (200 mm/300 mm wafers dedicated)[2]
Foup opener unit—300 mm wafers dedicated (with 200 mm adapter)[2]
Host communication—SECS-1/-2 and GEM compliant[2]
Vintage—2012 Vintage[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing