Waferpedia

Comparison ledger

22 AD 42versusDFL 7160 Laser Dicing

Blanchard 22 AD 42, Disco DFL 7160 Laser Dicing, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
22 AD 42Blanchard
OEMBlanchardDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 22 AD 42Disco DFL 7160
Specifications
Phase3 Phase[1]—
Frequency60 Hz[1]—
Voltage120 Vac[1]—
ConfigurationNo coolant tank[1]Non-operational[2]
Equipment type—Fully automatic laser saw[3]
Max. workpiece size—Φ300 mm[3]
Processing method—Ablation[3]
Laser wavelength—355 nm[4]
Laser maximum power—18 W[4]
X-axis processing range—310 mm[3]
Y-axis processing range—310 mm[3]
X-axis moving speed—0.1–600 mm/s[3]
X-axis index step—0.0001 mm[3]
Positioning accuracy—0.003/310 mm (single error), 0.002/5 mm[3]
Z-axis moving resolution—0.00005 mm[3]
Repeatability accuracy—0.002 mm[3]
θ-axis max. rotating angle—380 deg[3]
Equipment dimensions—1,200 × 1,550 × 1,800 mm[3]
Equipment weight—Approx. 1,750 kg[3]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]disco.co.jpdisco.co.jp
  4. [4]semistarcorp.comsemistarcorp.com