Comparison ledger
Branson 101-149-053 Gold Booster, Esec 2100 XP, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 101-149-053 Gold BoosterBranson | 2100 XPEsec |
|---|---|---|
| OEM | Branson | Esec |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | 2008– |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Branson 101-149-053 Gold Booster | Esec 2100 |
| Cited variants | — | |
| Specifications | ||
| Configuration | 1:1.5[3] | 50/60 Hz[6] |
| Manufacturer | Branson[4] | — |
| Model | 101-149-053[4] | — |
| Type | Gold Booster[4] | — |
| Operating frequency | 20 kHz[5] | — |
| Gain | 1:1.5[4] | — |
| Mounting thread | 1/2-20[5] | — |
| Length | 5.4 in[5] | — |
| Gain ratio | 1:1.5[4] | — |
| Voltage | — | 240 V[6] |
| Full Load Power | — | 2300 VA[6] |
| Bonding method | — | Epoxy[2] |
| Cycle time | — | 167 ms[2] |
| Bonding accuracy (3σ) | — | Down to 15 µm[2] |
| Placement precision | — | 5 µm (at 4 placements per second)[7] |
| Placement rate | — | 4 chips per second[7] |
| Wafer size | — | 4" to 12" (on 8" or 12" wafer frames)[2] |
| Die size range | — | 0.25 mm to 20 mm[2] |
| Leadframe size (length) | — | 90 mm to 300 mm[2] |
| Leadframe size (width) | — | 9 mm to 84 mm[2] |
| Frequency | — | 50/60 Hz[6] |
| Phase | — | Single phase[6] |
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