Comparison ledger
Branson 101-149-053 Gold Booster, Kulicke & Soffa IConn ProCu Plus LA, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 101-149-053 Gold BoosterBranson | IConn ProCu Plus LAKulicke & Soffa |
|---|---|---|
| OEM | Branson | Kulicke & Soffa |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Branson 101-149-053 Gold Booster | Kulicke & Soffa IConn |
| Specifications | ||
| Configuration | 1:1.5[1] | for Parts[4] |
| Manufacturer | Branson[2] | — |
| Model | 101-149-053[2] | — |
| Type | Gold Booster[2] | Fully automatic wire bonder[5] |
| Operating frequency | 20 kHz[3] | — |
| Gain | 1:1.5[2] | — |
| Mounting thread | 1/2-20[3] | — |
| Length | 5.4 in[3] | — |
| Gain ratio | 1:1.5[2] | — |
| Purpose | — | Make the electric connexion between the chip and the substratum with a gold or a copper wire[5] |
| Typical product | — | Typical ultra-fine pitch ball grid array product[5] |
| Minimum pad pitch | — | 35 µm[5] |
| Accuracy | — | 2 µm @ 3 sigma[5] |
| Minimum wire diameter | — | 0.6 mils[5] |
| Bond area | — | 56 mm x 87 mm[5] |
| Wire options | — | Copper wire option with forming gas[5] |
| Advanced node capability | — | Advanced node wafers down to 28 nm or below[5] |
| Process development/control | — | Wire pull and ball shear available[5] |
| Alternate wire option | — | Option de soudure de fil coincé sous capillaire (capillary wedge, wedge-to-wedge) with aluminum or gold wire[6] |
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