Waferpedia

Comparison ledger

017-0146-01 PrealignerversusNSR 2005 i 9 C i-Line

Brooks 017-0146-01 Prealigner, Nikon NSR 2005 i 9 C i-Line, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMBrooksNikon
CategoryLithographyLithography
Wafer size—Standard PDP 11/93 Computer & Silicon Carbide Wafer Loader Type 1 Conversion on it
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBrooks 017-0146-01 PrealignerNikon NSR 2005
Specifications
Configuration—HDD & Software included[1]
Wafer size—Standard PDP 11/93 Computer & Silicon Carbide Wafer Loader Type 1 Conversion on it[1]
Reticle—6", normal thickness[3]
Wafer—8", OF direction 0*, Ring type wafer[3]
Lens type—5iB3[3]
Magnification—1/5[3]
Field size—21.2 x 25.2mm[3]
Lamp power—1750 KW[3]
Light source—Mercury lamp[3]
Reticle Alignment—i-line, CCD imagining[3]
Make—Nikon[1]
Model—NSR 2005 i 9 C[1]
Reticle Size—6 inch[1]
Numerical Aperture (NA)—0.57 (selectable <0.57 >0.57)[5]
Exposure Light—i-line[5]
Sigma—0.56 – 0.80[5]
Alignment Light—HeNe Laser, Halogen Lamp[5]
Alignment Method—CCD imaging + image processing[5]
Alignment Mode—LSA (HeNe laser) or FIA (halogen lamp)[5]
XY Stage Drive Method—Ball screw drive & two-axis interferometer[5]
XY Stage Stroke X—−115 mm to +150 mm[5]
XY Stage Stroke Y—−160 mm to +115 mm[5]
Auto Focus Method—Halogen lamp + AF line sensor[5]
Wafer Leveling—Two-axis ball screw drive[5]
Chamber Set Temperature—23 °C[5]
Camera Type—CCD[5]
Power Supply—208 V, 3 Phase[4]
CE Mark Certified—Yes[4]
Handler Type—Prealign II[4]
Power—208 V, 3 Phase[4]
Manuals Included—Partial[4]
# of Cassette / FOUP Loaders—Cassette Stage[4]
Robot Type—OEM[4]
End Effecter Type—OEM[4]
Handler Options—SiC Substrate[4]
System SW (OS) Version—Nikon Nest[4]
Supporting Equipment—STD OEM Items[4]
CDA—N2[4]
DIW—Chilled Water[4]
PC Model—Present (original PC type)[5]
Hard Disk—Original[5]
NEST Upgrade—Version: NEST-2[5]
Wafer Size (6 inch)—6 inch[4]
Wafer Size (8 inch)—8 inch[3]
Numerical Aperture—0.57 (range <0.57 >0.57 selectable)[5]
Sigma Range—0.56 – 0.80[5]
Wafer Alignment Methods—LSA (HeNe laser), FIA (halogen lamp)[5]
Chamber Temperature Set—23 °C[5]
Camera / Vision—CCD Type[5]
Computer (some units)—Standard PDP 11/93[1]
Wafer Loader (some units)—Silicon Carbide Wafer Loader Type 1 Conversion[1]

Plan your fab

Building a Lithography process? Get a complete equipment list.

Open the fab equipment planner →
Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]inventory listing
  4. [4]inventory listing
  5. [5]inventory listing