Waferpedia

Comparison ledger

Ecomat 250versus15 Lapper

Buehler Ecomat 250, Lapmaster 15 Lapper, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
Ecomat 250Buehler
15 LapperLapmaster
OEMBuehlerLapmaster
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBuehler Ecomat 250Lapmaster 15
Specifications
ConfigurationPolisher / Grinder[1]Equipped with:[2]
Number Of Conditioning Rings—Up to 3[2]
Ring ID—Up to 5.5″[2]
Plate Diameter – Outside—15″[2]
Plate Diameter – Inside—3 1/2″[2]
Standard RPM—60[2]
Drive Motor—1/2 HP[2]
Electrics—110V / 1Ph / 60Hz[2]
Dimensions – Approximate—26″(L-R) x 21″(F-B) x 22″(H)[2]
Equipped with: 15″ Cast Iron Plate—Included[2]
Equipped with: (3) Yoke/Roller Bearing Assemblies—Included[2]
Equipped with: (3) Conditioning Rings—Included[2]
Equipped with: (3) Hold Downs—Included[2]
Equipped with: 30 Minute Timer—Included[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing