Waferpedia

Comparison ledger

Ecomet 6versus12 Lapper

Buehler Ecomet 6, Lapmaster 12 Lapper, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
Ecomet 6Buehler
12 LapperLapmaster
OEMBuehlerLapmaster
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBuehler Ecomet 6—
Specifications
TypeVariable speed grinder/polisher[1]—
Chuck diameter8 inches[1]—
Max speed340 rpm[1]—
Water requirementRequired[1]—
Electrical115V 60Hz 15A[1]—
Dimensions (L x W x H)30 x 30 x 16 inches[2]—
Weight160 lb[2]—
Outside plate diameter—12 inches[3]
Lapping Speed Range—0 to 60 rpm[4]
Wafer Size Compatibility—4 inches or smaller[3]
Input Voltage—110 V[3]
Frequency—60 Hz[3]
Phase—1[3]
Number of Rings—3[3]
Number of Weights—3[3]
Includes Slurry System—Yes[3]
Includes Timer—Yes[3]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]yorkscientific.comyorkscientific.com
  2. [2]hgrinc.comhgrinc.com
  3. [3]jmind.comjmind.com
  4. [4]etd.ohiolink.eduetd.ohiolink.edu