Waferpedia

Comparison ledger

103-754versus300

Cascade Microtech 103-754, Cascade Microtech 300, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
103-754Cascade Microtech
300Cascade Microtech
OEMCascade MicrotechCascade Microtech
CategoryTest & ProbeTest & Probe
Wafer size6-inch diameter microchamber and thermal chuck300mm
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyCascade Microtech 103-754Cascade Microtech 300
Cited variants—
Specifications
typex-y-z-θ probe positioner[2]—
installed onHFTL 50-GHz Small-Signal Probe Station[2]—
quantity in stationtwo[2]—
station chuck size6-inch-diameter microchamber and thermal chuck[2]—
Quantity per stationTwo positioners[2]—
Chuck size6-inch-diameter microchamber and thermal chuck[2]—
Temperature range-50 to 200 °C[2]—
Wafer size—≤ 300 mm[1]
CM300 description—Flexible on-wafer probe system[1]
Control software—Velox™ probe station control software[1]
Automation/features—Safe and fast wafer loading and easy test automation and measurement[1]
Application—On-wafer test[1]
Position in product line—300 mm probing solutions[1]
Positioning—precision and versatility[1]
Testing scope—a wide range of advanced, complex testing requirements[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]cnf.cornell.educnf.cornell.edu
  3. [3]web.archive.orgweb.archive.org