Waferpedia

Comparison ledger

100versusNSR 2205 i 8 A i-Line

CEE 100, Nikon NSR 2205 i 8 A i-Line, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
100CEE
OEMCEENikon
CategoryLithographyLithography
Wafer size6"6"
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyCEE 100Nikon NSR 2205
Cited variants—
Specifications
Tool typeSpray Developer[1]—
Accepts wafer sizeup to 6" wafers[2]—
Programmable programs10 programs[2]—
Steps per programup to 10 steps[2]—
Programmable step parametersAcceleration, Speed, Time[2]—
Associated documentCEE Model 100CB Spinner.doc[2]—
Wafer sizeUp to 6 inches[2]Wafer Loader Pre-alignment 2[3]
Programs10 programs each with up to 10 steps[2]—
Control parametersAcceleration, Speed, Time[2]—
Resolution—0.5µm[3]
Computer Type—PDP11[3]
Rentical Size—5 Inch[3]
Field Sizes—15 / 17.5 / 20mm[3]
Wafer Size—6 Inch Flat[3]
Reticle Libraries—1[3]
Wafer Loader—Type 1[3]
Configuration—Barcode Reader[3]
Wafer Loader Indexers—2[3]
Autofocus—Single Point[3]
Chuck Type—Ceramic Ring Chuck[3]
Water Stage—Ballscrew[3]
MCS2 Version—2.4B[3]

Plan your fab

Building a Lithography process? Get a complete equipment list.

Open the fab equipment planner →
Sources (3)Every fact above is drawn from these public sources
  1. [1]nanofab.ece.cmu.edunanofab.ece.cmu.edu
  2. [2]nanofab.utah.edunanofab.utah.edu
  3. [3]inventory listing