Comparison ledger
CEE 1000 Hot Plate, Heller PCO 520, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | PCO 520Heller | |
|---|---|---|
| OEM | CEE | Heller |
| Category | Thermal / Diffusion | Thermal / Diffusion |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | CEE 1000 Hot Plate | Heller PCO 520 |
| Specifications | ||
| Configuration | 4"[1] | — |
| Type | Hot Plate[1] | — |
| Wafer Size | 4 inch[1] | — |
| Phase | — | 3 Phase[2] |
| Largest Heater Load | — | 20.7 A[2] |
| Short Circuit Interrupting Capacity | — | 10K A[2] |
| Equipment type | — | Pressure curing oven[3] |
| Make | — | Heller[2] |
| Model | — | PCO 520[2] |
| Voltage | — | 208-220 V[2] |
| Current | — | 102 A[2] |
| Frequency | — | 50-60 Hz[2] |
| Typical process time | — | 120 min or per user spec[3] |
| Operating temperature | — | 60°C – 200°C[3] |
| Max temperature | — | 220°C[3] |
| Operating pressure | — | 1 – 10 bar[3] |
| Capacity | — | 24 magazines (typical)[3] |
| Cooling method | — | PCW (17°C – 23°C)[3] |
| Cooling water pressure | — | 25 – 40 psi[3] |
| Oven size | — | 2,200[L] x 1,700[W] x 1,700[H] mm[3] |
| Chamber usable area | — | 716.5[L] x 608[W] x 440[H] mm[3] |
| Max operating pressure | — | 10 bar (145 psi)[3] |
| Max operating temperature | — | 200°C[3] |
| Loading type | — | Manual loading[3] |
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