Comparison ledger
CEE 1000 Hot Plate, YES PB8-2P-CP, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | PB8-2P-CPYES | |
|---|---|---|
| OEM | CEE | YES |
| Category | Thermal / Diffusion | Thermal / Diffusion |
| Wafer size | — | 8 in. wafers |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | CEE 1000 Hot Plate | YES PB8-2P-CP |
| Cited variants | — | |
| Specifications | ||
| Configuration | 4"[2] | — |
| Type | Hot Plate[2] | — |
| Wafer Size | 4 inch[2] | — |
| Manufacturer | — | Yield Engineering Systems (YES)[3] |
| Model | — | YES-PB8-2P-CP[3] |
| Product family | — | Polyimide Bake Ovens / High Temperature Vacuum Bake/Cure Ovens for BCB/Polyimide[1] |
| Wafer capacity | — | 2 cassettes of 8 in. wafers[1] |
| Chamber configuration | — | Single compartment[1] |
| Chamber description | — | 9.9 in. x 25.7 in. deep chamber[1] |
| Controller | — | CTC Controller with Color Touchscreen[1] |
| Listed options | — | Cooling Package[1] |
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