Waferpedia

Comparison ledger

03 iX AutomaticversusVersaflow 3 66 XL Selective Soldering

Dek 03 iX Automatic, ERSA Versaflow 3 66 XL Selective Soldering, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMDekERSA
CategoryAssembly / SMTAssembly / SMT
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDek 03 iX AutomaticERSA Versaflow 3 66 XL Selective Soldering
Specifications
Vintage2020[1]—
Length—10,050 mm[2]
Width—1,900 mm[2]
Height—1,650 mm[2]
Conveyor system—Pin chain conveyor or roller conveyor[2]
PCB width—100-610 mm[2]
PCB length—150-3,000 mm[2]
Max. PCB superstructures top—up to 120 mm[2]
Max. PCB superstructures at the bottom—up to 60 mm[2]
Max. PCB weight—10 kg (opt. 20 kg)[2]
Fluxer—Drop jet in various sizes[2]
Preheating—IR radiator heating, convection or combination of IR and convection[2]
Soldering module—Electromagnetic soldering pot; 1 module with up to 2 pots, solder volume 13 kg/pot[2]
Number of spray heads—Up to 4[2]
Number of preheating modules at the bottom—Up to 5 with optional convection top heating[2]

Plan your fab

Building a Assembly / SMT process? Get a complete equipment list.

Open the fab equipment planner →
Sources (2)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]kurtzersa.comkurtzersa.com