Comparison ledger
Disco 3220, Disco DFG 850 Back, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 3220Disco | DFG 850 BackDisco |
|---|---|---|
| OEM | Disco | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco 3220 | Disco DFG |
| Specifications | ||
| equipment type | dicing saw[1] | — |
| Workplace size | ø150 mm[2] | — |
| Spindle layout | Single[2] | — |
| Spindle output | 1.5 kW at 30,000 min-1[2] | — |
| Spindle max revolution speed | 40,000 min-1[2] | — |
| X-axis feed speed range | 0.1 – 500 mm/s[2] | — |
| Y-axis index step | 0.0001 mm[2] | — |
| Z-axis repeating accuracy | 0.001 mm[2] | — |
| Z-axis max blade size | ø58 mm[2] | — |
| Power | — | 200-208 V, 50/60 Hz, 3 Phase[3] |
| Spindle Type | — | Air Bearings[3] |
| Maximum Spindle Speed | — | 7,000 RPM[3] |
| External Cooling | — | Water Cooled[3] |
| Configuration | — | Disco DVC 011 Vacuum Coolant Unit[3] |
| Associated Coolant Unit | — | Disco DVC 011 Vacuum Coolant Unit[3] |
| Wafer Sizes | — | 8 inch[4] |
| Vacuum Coolant Unit | — | Disco DVC 011[3] |
Plan your fab
Building a Dicing & Grinding process? Get a complete equipment list.
Open the fab equipment planner →