Comparison ledger
Disco 3220, Disco DGP 8761 DFM 2800 Back, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 3220Disco | |
|---|---|---|
| OEM | Disco | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | 2 Independent loadports, 25 wafer front opening unified pod (FOUP) carrier |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco 3220 | Disco DGP 8761 |
| Specifications | ||
| equipment type | dicing saw[1] | — |
| Workplace size | ø150 mm[2] | — |
| Spindle layout | Single[2] | — |
| Spindle output | 1.5 kW at 30,000 min-1[2] | — |
| Spindle max revolution speed | 40,000 min-1[2] | — |
| X-axis feed speed range | 0.1 – 500 mm/s[2] | — |
| Y-axis index step | 0.0001 mm[2] | — |
| Z-axis repeating accuracy | 0.001 mm[2] | — |
| Z-axis max blade size | ø58 mm[2] | — |
| Voltage | — | 200 VAC[3] |
| Phase | — | 3 Phase[3] |
| Full Load Current | — | 72 A[3] |
| Wafer size | — | 2 Independent loadports, 25 wafer front opening unified pod (FOUP) carrier[4] |
| Configuration | — | Pedestal style with vacuum[4] |
| OEM | — | Disco[3] |
| Model | — | DGP 8761 / DFM 2800[3] |
| Equipment type | — | Back Grinder[3] |
| Loadports | — | 2 independent loadports[4] |
| Carrier | — | 25 wafer front opening unified pod (FOUP) carrier[4] |
| Wafer handling robot | — | Wafer handling robot[4] |
| Wafer alignment system | — | Wafer alignment system with capability for notch detection and precise alignment[4] |
| Vacuum style | — | Pedestal style with vacuum[4] |
| Wafer ID reader | — | Included[4] |
| Chuck cleaning system | — | Included[4] |
| Porous vacuum chucks | — | 4[4] |
| Independent transfer arms | — | 2[4] |
| Wet grind spindles | — | 2 independent wet grind spindles[4] |
| Dry polish spindle | — | Included[4] |
| Grind wheels | — | 2[4] |
| Polishing wheel | — | Included[4] |
| Spin-dry station | — | Included[4] |
| Tape-side wash | — | For clean post grind[4] |
| Power | — | 200 VAC, 3 Phase[3] |
Plan your fab
Building a Dicing & Grinding process? Get a complete equipment list.
Open the fab equipment planner →