Waferpedia

Comparison ledger

3220versusDW 288 S 4 Diamond

Disco 3220, Meyer Burger DW 288 S 4 Diamond, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
3220Disco
DW 288 S 4 DiamondMeyer Burger
OEMDiscoMeyer Burger
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco 3220Meyer Burger DW 288
Specifications
equipment typedicing saw[1]—
Workplace sizeø150 mm[2]—
Spindle layoutSingle[2]—
Spindle output1.5 kW at 30,000 min-1[2]—
Spindle max revolution speed40,000 min-1[2]—
X-axis feed speed range0.1 – 500 mm/s[2]—
Y-axis index step0.0001 mm[2]—
Z-axis repeating accuracy0.001 mm[2]—
Z-axis max blade sizeø58 mm[2]—
Configuration—Wire Management System WM2[3]
Operating hours of Mc—18,534 hours[3]
Operating hours of automatic Mc—453 hours[3]
Operating hours of main drive—534 hours[3]
13112403/2—Way Solenoid Valve DN4 reference 10040439 (1)[3]
1310366—Cutting Fluid additive ADDITIVEA33 ref BLASER 29106020001 (1)[3]
1310362—Beam DMT710 420x50x16mm 100mm radius ref 10266500 (95)[3]
1310361—Beam DMT710 420x50x16mm 75mm radius ref 10266493 (175)[3]
1310363—Beam DMT710 carre 156 420x156x16mm ref 10266501 (95)[3]
1310364—Fil diamante 12 PLAU, 60KM, MB50 ref 12PLAU0F31560A (6)[3]
Manufacturer—Meyer Burger[3]
Model—DW 288 S 4[3]
Category—Dicing & Grinding[4]
Machine type—Multi Wire Saw[5]
Application—Smart slicing technology for sapphire, and other hard and brittle materials[5]
Process—Slicing semiconductor silicon and sapphire into wafer[5]
Work piece dimensions—Max. Ø 8″ × 420 mm or ≤ 210 × 420 mm[6]
Web length—420 mm[6]
Wire speed—25 m/s (1500 m/min)[6]
Wire acceleration—8 m/s² (< 4 s)[6]
Min. wire diameter—100 μm[6]
Max. wire tension—45 N[6]
Rocking principle—Rocking of work piece[6]
Rocking angle—± 12°[6]
Wire guide roller axis distance—540 mm[6]
Cutting fluid tank—240 l[6]
Machine dimensions—3620 × 1780 × 3010 mm[6]
Machine weight—10500 kg[6]
Power & electrical—Standard Europe power management (400V, 230V Schuko plugs)[4]
US electrical conversion—UL conversion and voltage conversion (480V, 110V plugs)[4]
Wire management system—WM2[3]
Cutting fluid media module—Saphir cutting fluid media module with long filter[3]
Cutting fluid manifold—Without regulation valves, 1 mechanical flow meter, and flow bars[3]
Tank drain—With hand valve[3]

Plan your fab

Building a Dicing & Grinding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (6)Every fact above is drawn from these public sources
  1. [1]nanofab.utah.edunanofab.utah.edu
  2. [2]semistarcorp.comsemistarcorp.com
  3. [3]inventory listing
  4. [4]waferpedia.comwaferpedia.com
  5. [5]lapmaster-wolters.comlapmaster-wolters.com
  6. [6]precision-surface.comprecision-surface.com