Waferpedia

Comparison ledger

DAD 3241 Automatic Dicingversus15

Disco DAD 3241 Automatic Dicing, Lapmaster 15, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
15Lapmaster
OEMDiscoLapmaster
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco DADLapmaster 15
Specifications
ConfigurationStarter kit for 2" hub mount set[1]—
Max. workpiece sizeΦ8 inch (200 mm × 200 mm user-specified specification)[2]—
Spindle count1[2]—
X-axis cutting speed0.1~800 mm/s[2]—
Y-axis index positioning accuracy0.002/210 mm (Single error)[2]—
Spindle rated output1.8 kW at 60,000 min-1[2]—
Rotation speed range6,000 ~ 60,000 min-1[2]—
Equipment dimensions (W×D×H)650 × 950 × 1,670 mm[2]—
Equipment weightApprox. 550 kg[2]—
Input Power—110 Vac[3]
Plate Diameter—15 inches (381 mm)[4]
Number of Conditioning Rings—3[4]
Ring ID—5.5 inches (140 mm)[4]
Standard RPM—60[4]
RPM Range (Variable Speed Drive)—0-60[4]
Drive Motor - Lapper—0.5 HP (0.37 kW)[4]
Drive Motor - Polisher—0.75 HP (0.56 kW)[4]
Length—25 inches (635 mm)[4]
Width—20 inches (508 mm)[4]
Height—24 inches (610 mm)[4]
Estimated Shipping Weight—285 lbs (129.3 kg)[4]

Plan your fab

Building a Dicing & Grinding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]web.archive.orgweb.archive.org
  3. [3]inventory listing
  4. [4]web.archive.orgweb.archive.org