Comparison ledger
Disco dad3240-dicing-saw, Disco DFL7340-stealth-dicer, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | dad3240-dicing-sawDisco | |
|---|---|---|
| OEM | Disco | Disco |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | 200mm | 200mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco dad3240-dicing-saw | Disco DFL7340-stealth-dicer |
| Specifications | ||
| vendor | Disco[1] | — |
| model | DFL7340[1] | — |
| process area | Packaging[1] | — |
| compatible materials | Si wafers only[1] | — |
| engine | SDE03 engine with λ = 1342 nm[1] | — |
| maximum sample diameter | 200 mm[1] | — |
| dicing orientation | Topside or backside (through tape) dicing possible[1] | — |
| OEM | — | Disco[1] |
| Model | — | DFL7340[1] |
| Process area | — | Packaging[1] |
| Compatible materials | — | Dedicated to dicing Si wafers only[1] |
| Laser engine wavelength | — | λ = 1342 nm[1] |
| Maximum sample diameter | — | 200 mm[1] |
| Dicing orientation | — | Topside or backside (through tape) dicing possible[1] |
| Si resistivity requirement | — | ρ > 0.01 Ω•cm[1] |
| Surface roughness requirement | — | Dicing streets must be smooth (mirror polish) on the surface where the laser is incident[1] |
| Street clearance requirement | — | Wafer must be metal-free in a width 0.4 × substrate thickness, centred on the dicing street[1] |
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