Waferpedia

Comparison ledger

DCS 1440 Wafer Cleaner Spinversus1000FP

Disco DCS 1440 Wafer Cleaner Spin, YES 1000FP, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMDiscoYES
CategoryWet Processing / CleanWet Processing / Clean
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco DCSYES 1000FP
Specifications
Configuration5 in. table[1]—
Max. workpiece sizeΦ8 inch[2]—
Table RPM100 - 3000 min^-1[2]—
Setting time for cleaning/drying0 - 999 sec[2]—
Cleaning nozzle speed1 - 37.5 °/sec[2]—
Cleaning rangeΦ365 mm (up to 210 x 210 mm)[2]—
Cleaning pressure range2.3 - 11.8 MPa[2]—
Equipment dimensions (W×D×H)400 × 600 × 1220 mm[2]—
Dry massApprox. 124 kg[2]—
Voltage200-240 VAC[1]—
Frequency50/60 Hz[1]—
Table size5 in.[1]—
Arm configurationDouble arm[1]—
Wiring3 Wire + ground[1]—
System type—Plasma cleaning system[3]
Line—R-Series Plasma Cleaning Systems (Glen Technologies)[3]
Model—Glen/YES 1000FP[3]
Designed use—Designed to accept a range of shelf sizes[3]
Application focus—Changing needs of the flat panel industry[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]disco.co.jpdisco.co.jp
  3. [3]web.archive.orgweb.archive.org