Waferpedia

Comparison ledger

DGP 8760versus12 Lapper

Disco DGP 8760, Lapmaster 12 Lapper, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
12 LapperLapmaster
OEMDiscoLapmaster
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco DGP 8760—
Specifications
Outside plate diameter—12 inches[1]
Lapping Speed Range—0 to 60 rpm[2]
Wafer Size Compatibility—4 inches or smaller[1]
Input Voltage—110 V[1]
Frequency—60 Hz[1]
Phase—1[1]
Number of Rings—3[1]
Number of Weights—3[1]
Includes Slurry System—Yes[1]
Includes Timer—Yes[1]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]jmind.comjmind.com
  2. [2]etd.ohiolink.eduetd.ohiolink.edu