Waferpedia

Comparison ledger

DGP 8760versus15 Lapper

Disco DGP 8760, Lapmaster 15 Lapper, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
15 LapperLapmaster
OEMDiscoLapmaster
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco DGP 8760Lapmaster 15
Specifications
Number Of Conditioning Rings—Up to 3[1]
Ring ID—Up to 5.5″[1]
Plate Diameter – Outside—15″[1]
Plate Diameter – Inside—3 1/2″[1]
Standard RPM—60[1]
Drive Motor—1/2 HP[1]
Electrics—110V / 1Ph / 60Hz[1]
Dimensions – Approximate—26″(L-R) x 21″(F-B) x 22″(H)[1]
Configuration—Equipped with:[1]
Equipped with: 15″ Cast Iron Plate—Included[1]
Equipped with: (3) Yoke/Roller Bearing Assemblies—Included[1]
Equipped with: (3) Conditioning Rings—Included[1]
Equipped with: (3) Hold Downs—Included[1]
Equipped with: 30 Minute Timer—Included[1]

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Sources (1)Every fact above is drawn from these public sources
  1. [1]inventory listing