Comparison ledger
EV Group 101, Nikon NSR SF 100 i-Line, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 101EV Group | NSR SF 100 i-LineNikon |
|---|---|---|
| OEM | EV Group | Nikon |
| Category | Lithography | Lithography |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | EV Group 101 | Nikon NSR |
| Specifications | ||
| OEM | EV Group[1] | — |
| Model | 101[1] | — |
| Equipment name | EVG 101 Spray Coater[1] | — |
| NEMO ID | evgspraycoat[1] | — |
| Training required | EVG 101 Training[1] | — |
| Training duration | 1.50 hours[1] | — |
| Processing technique | Resist Spray Coat (manual)[1] | — |
| Cleanliness | "All"[1] | — |
| Location | SNF Paul G Allen L107 Cleanroom[1] | — |
| Wafer diameter (substrate size) | up to 300 mm[2] | — |
| Available modules | Spin coat / OmniSpray® / develop[2] | — |
| Wafer handling options | Bowed / warped / thin wafer handling, edge handling[2] | — |
| Dispense options | Various resist dispense pumps covering viscosities up to 52000 cP; constant pressure dispense systems; EBR / BSR / pre-wet / bowl wash / liquid priming[2] | — |
| Processing technique (at SNF) | Resist Spray Coat (manual)[3] | — |
| Cleanliness group (at SNF) | "All"[1] | — |
| Configuration | — | 6" reticle[4] |
| Resolution | — | 0.4um or less[4] |
| N.A. | — | 0.5[4] |
| Exposed light source | — | i-line (wavelength = 365nm)[4] |
| Exposure range | — | 25x33mm[4] |
| Alignment accuracy | — | 45nm or less (M + 3 sigma)[4] |
| Throughput | — | 120 wafers / hour (200mm wafer), 80 wafers / hour (300mm wafer, approximately)[4] |
| Reduction ratio | — | 1:4[5] |
| Exposure field | — | 25 x 33 mm[5] |
| Throughput (200 mm wafer) | — | 120 wafers/hour or more[5] |
| 300 mm configuration | — | Field-upgradable to a fully compliant 300 mm configuration[5] |
| Numerical aperture (N.A.) | — | 0.5[4] |
| Wafer sizes | — | 8 inch[4] |
| Throughput (300 mm wafer) | — | 80 wafers/hour (approximately)[4] |
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