Comparison ledger
EV Group 101, SUSS MicroTec MA 200, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 101EV Group | MA 200SUSS MicroTec |
|---|---|---|
| OEM | EV Group | SUSS MicroTec |
| Category | Lithography | Lithography |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | EV Group 101 | SUSS MicroTec MA 200 |
| Specifications | ||
| OEM | EV Group[1] | — |
| Model | 101[1] | MA 200[4] |
| Equipment name | EVG 101 Spray Coater[1] | — |
| NEMO ID | evgspraycoat[1] | — |
| Training required | EVG 101 Training[1] | — |
| Training duration | 1.50 hours[1] | — |
| Processing technique | Resist Spray Coat (manual)[1] | — |
| Cleanliness | "All"[1] | — |
| Location | SNF Paul G Allen L107 Cleanroom[1] | — |
| Wafer diameter (substrate size) | up to 300 mm[2] | — |
| Available modules | Spin coat / OmniSpray® / develop[2] | — |
| Wafer handling options | Bowed / warped / thin wafer handling, edge handling[2] | — |
| Dispense options | Various resist dispense pumps covering viscosities up to 52000 cP; constant pressure dispense systems; EBR / BSR / pre-wet / bowl wash / liquid priming[2] | — |
| Processing technique (at SNF) | Resist Spray Coat (manual)[3] | — |
| Cleanliness group (at SNF) | "All"[1] | — |
| Voltage | — | 230 V[4] |
| Configuration | — | 3200 VA[4] |
| Frequency | — | 50 Hz[4] |
| Manufacturer | — | SUSS[4] |
| Category | — | Aligner[5] |
| Wafer sizes | — | 6 inch[4] |
| Referenced in process guidance | — | AZ P4000 Series exposure-dose guidance lists Suss MA-200 and gives approximate dose values of 1.5 μm = 90 mJ/cm2, 3.5 μm = 135 mJ/cm2, and 12 μm = 800 mJ/cm2[6] |
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