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Comparison ledger

120 Automated Coater ProcessingversusHS 9050

EV Group 120 Automated Coater Processing, Hitachi HS 9050, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
HS 9050Hitachi
OEMEV GroupHitachi
CategoryResist ProcessingResist Processing
Wafer size—Mini-Environment Wafer Loading Module (EFEM)
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyEV Group 120 Automated Coater ProcessingHitachi HS 9050
Specifications
Configuration50/60 Hz[1]Multi-chamber[2]
Phase3 Phase[1]—
Wafer sizes6 inch, 8 inch[1]—
Frequency50/60 Hz[1]—
Wiring configuration4 Wire + GND[1]—
Vintage2015[1]—
Wafer size—Mini-Environment Wafer Loading Module (EFEM)[2]
Centering Unit—V-notch alignment and centering[2]
Make—Hitachi[2]
Model—HS 9050[2]
Tool type—Asher[2]
Wafer loading module—Copper Mini-Environment Wafer Loading Module (EFEM)[2]
Load ports—3 ea 25-wafer FOUP-capable load ports with N2 purge[2]
Robot—Four Axis Robot[2]
Chamber count—7 chamber tool[2]
Ashing units—Five (5) Ashing Units[2]
Source unit—Lambda Source Unit[2]
Capacitance manometer—722B11TCD2FA[2]
RF power supply—AXG-5000Ⅲ-27M-KE[2]
EPD—Multi-wavelength EPD, 0.1s sampling (Spectrometer)[2]
MFC #N—N2 Max Flow 20 L/min[2]
MFC #1—O2 Max Flow 20 L/min[2]
MFC #2—Ar Max Flow 20 L/min[2]
MFC #3—H2 Max Flow 5 L/min[2]
MFC #4—N2 Max Flow 20 L/min[2]
MFC #5—CF4 Max Flow 1 L/min[2]
MFC #6—CO2 Max Flow 0.4 L/min[2]
MFC #7—He Max Flow 20 L/min[2]
MFC #8—Without gasline, without MFC[2]
MFC #9—Without gasline, without MFC[2]
MFC #10—Without gasline, without MFC[2]
Cooling units—Two (2) Cooling Units[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing