Waferpedia

Comparison ledger

1088versus5200 Diffusion

Heller 1088, Thermco 5200 Diffusion, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
1088Heller
OEMHellerThermco
CategoryThermal / DiffusionThermal / Diffusion
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyHeller 1088Thermco 5200 Diffusion
Specifications
Heating Zones8 zones (4 top and 4 below) plus 1 cooling zone[1]—
Heating MethodForced convection[1]—
Conveyor Width18 inches (45 cm)[1]—
Heated Length43.5 inches (111 cm)[1]—
Overall Length96 inches (244 cm)[1]—
Height50 inches (127 cm)[1]—
Net Weight900 lbs (409 kg)[1]—
Thermal ProfilerIncluded[1]—
Oven TopCounter balance for easy access to conveyor[1]—
Solder CompatibilityLead-free and leaded soldering[1]—
Configuration—Boron[2]
Make—Thermco[3]
Model—5200[3]
Wafer size—6 inch[3]
Process chambers—Two to four-process chamber systems[4]
Substrate diameter—Up to 150 mm[4]
Applications—Semiconductor, PV, LED, Nano, and MEMS substrates[4]
Control system—Thermco TMX controller[4]
Heating zones—3 independently controlled heating zones[4]
Operating temperature range—200°C to 1350°C[4]
Flatzone—1,100 mm[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]smtdevices.comsmtdevices.com
  2. [2]inventory listing
  3. [3]Equipment inventory listing
  4. [4]thermcosystems.comthermcosystems.com