Comparison ledger
Hitachi 1305 BSG 3, Nitto HR 8500 III TW UV Detaper, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1305 BSG 3Hitachi | |
|---|---|---|
| OEM | Hitachi | Nitto |
| Category | Wet Processing / Clean | Wet Processing / Clean |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Hitachi 1305 BSG 3 | Nitto HR 8500 III TW UV Detaper |
| Specifications | ||
| Control Method | — | One Board Micro Computer[1] |
| Wafer Transfer Robot | — | 3-axis type[1] |
| Configuration | — | Installation Environment:[1] |
| Temperature | — | 25 ± 5 degrees C[1] |
| Humidity | — | 45 ± 15%[1] |
| Others | — | Clean level ; Class 1,000 or more (Place where it will be subjected to direct sunlight)[1] |
| Power | — | 1.5 kVA[1] |
| For Air | — | Rc 3/8 screw[1] |
| Lug with grounding linw (Cable Length | — | Approx. 5m)[1] |
| OEM | — | Nitto Denko[1] |
| Model | — | HR 8500 III TW UV[1] |
| Wafer Sizes | — | 8 inch[1] |
| Clean level | — | Class 1,000 or more[1] |
| Power Supply | — | Single Phase; AC 100 V ± 5%; 1.5 kVA; 50/60 Hz[1] |
| Air Supply | — | Dry Air; 0.5 MPa or more; 250 NL/min or more[1] |
| Connection Port | — | For electrical power; For Air: Rc 3/8 screw; Lug with grounding linw (Cable Length: Approx. 5m)[1] |
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