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Comparison ledger

1305 BSG 3versusDSS 200 Integrated Circuit

Hitachi 1305 BSG 3, Ontrak DSS 200 Integrated Circuit, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
1305 BSG 3Hitachi
OEMHitachiOntrak
CategoryWet Processing / CleanWet Processing / Clean
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyHitachi 1305 BSG 3Ontrak DSS 200 Integrated Circuit
Cited variants—
  • DSS 200 Series 1[1]
  • DSS 200 Series 2[2]
  • DSS 200 Series 2 CE[3]
  • DSS 200 Synergy[3]
  • DSS 200 Integra[3]
Specifications
Wafer size range—100mm to 200mm[1]
Throughput—45-65 wafers per hour[2]
Cleaning method—Double-sided PVA scrub[1]
Brush type—Roller PVA[3]
Drying method—Spin dry with heat lamp[1]
Control system—Windows-based[3]
Brush boxes—Dual[1]
Ammonia dispense—Yes[1]
Robotic unload—Yes[1]
Touchscreen controls—Yes[1]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]axustech.comaxustech.com
  2. [2]axustech.comaxustech.com
  3. [3]entrepix.comentrepix.com