Waferpedia

Comparison ledger

1305 BSG 3versusDSS 200 Series II Wafer

Hitachi 1305 BSG 3, Ontrak DSS 200 Series II Wafer, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
1305 BSG 3Hitachi
OEMHitachiOntrak
CategoryWet Processing / CleanWet Processing / Clean
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones—2023 Introduced
Control system——
Generation——
FamilyHitachi 1305 BSG 3Ontrak DSS 200
Specifications
Configuration—Post CMP[1]
Make—Ontrak[1]
Model—DSS 200 Series II Wafer[1]
Equipment type—Wafer Scrubber[1]
Wafer sizes—6 inch[1]
Tool description—post-CMP semiconductor process tool[2]
Application—cleaning wafers after chemical mechanical polishing[2]
Wafer size—8 inch[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com