Waferpedia

Comparison ledger

2060versusMY 12

Juki 2060, Mydata MY 12, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
2060Juki
MY 12Mydata
OEMJukiMydata
CategoryAssembly / SMTAssembly / SMT
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyJuki 2060Mydata MY 12
Specifications
Configuration—50/60 Hz[1]
Type—pick and place machine[2]
Category—Assembly / SMT[2]
Power / electrical—50/60 Hz[2]
Placement rate, standard performance—6,500 CPH[3]
HYDRA Speedmount placement rate on chips—21,000 CPH[3]
Linescan Vision System placement rate on fine-pitch components—6,100 CPH[3]
Accuracy—Repeatability of 15 mm at 3 sigma[3]
Feeder capacity—144 x 8 mm tapes or 135 SOIC tubes or 112 x 8 mm tapes and 32 JEDEC trays (with TEX)[3]
Rated speed—21,000 CPH IPC 9850 chip net throughput 17,500 CPH[4]
Fine-pitch rated speed—6,100 CPH IPC 9850 fine pitch net throughput 1,500 CPH[4]
Board handling: maximum board size—384 x 508 mm, 563 x 508 mm, 745 x 610 mm, or 932 x 732 mm depending on configuration[4]
Machine size—3360 mm length, 1450 mm height, 2000 mm depth, 2134 mm depth, or 2378 mm depth depending on configuration[4]
Weight—2100 kg[4]
Power requirements—Three phase AC 6.6 kVA (3 x 2.2 kVA)[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]ibesmt.comibesmt.com
  4. [4]as-equipment.deas-equipment.de