Comparison ledger
KLA 0035235-003 MMD Head, KLA Candela CS 20 Surface, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | ||
|---|---|---|
| OEM | KLA | KLA |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | KLA 0035235-003 MMD Head | KLA Candela CS 20 |
| Specifications | ||
| Configuration | TSTD PCB ASSY, MMD MEAS HEAD[1] | — |
| Model | 0035235-003[1] | Candela CS 20[2] |
| Make | KLA[1] | — |
| Part Description | TSTD PCB ASSY, MMD MEAS HEAD[1] | — |
| Compatible System | KLA AIT-XP[1] | — |
| Voltage | — | 230V; 6 Amps[2] |
| Phase | — | 50/60Hz; Phase 1[2] |
| OEM | — | KLA[2] |
| Category | — | Metrology & Inspection[3] |
| Wafer size | — | 6 inch[2] |
| Current | — | 6 Amps[2] |
| Frequency | — | 50/60Hz[2] |
| Inspection type | — | Optical non-patterned wafer defect inspection system[4] |
| Primary application | — | Bare (non-patterned) silicon wafer surface defect detection[4] |
| Throughput | — | 30 WPH for 150 mm wafers; 27 WPH for 200 mm wafers[4] |
| Resolution | — | 83 nm[4] |
| Substrate diameter range | — | 50.8 mm – 200 mm (2″ – 8″)[4] |
| Thickness range | — | 350 µm – 1,100 µm[4] |
| Minimum detectable defect size | — | 0.3 µm (PSL sphere equivalent, ≥95% capture rate on bare Si)[4] |
Plan your fab
Building a Metrology & Inspection process? Get a complete equipment list.
Open the fab equipment planner →