Comparison ledger
KLA 0035235-003 MMD Head, Zeiss LEO 1560, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | LEO 1560Zeiss | |
|---|---|---|
| OEM | KLA | Zeiss |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | — | 6” wafer loading through the loadlock is possible |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | KLA 0035235-003 MMD Head | Zeiss LEO |
| Specifications | ||
| Configuration | TSTD PCB ASSY, MMD MEAS HEAD[1] | 6" stage and loadlock[2] |
| Model | 0035235-003[1] | — |
| Make | KLA[1] | — |
| Part Description | TSTD PCB ASSY, MMD MEAS HEAD[1] | — |
| Compatible System | KLA AIT-XP[1] | — |
| Wafer size | — | 6” wafer loading through the loadlock is possible[2] |
| Known issues | — | Some Flickering on image of chamber scope[3] |
| Resolution | — | 1 nm at 20 kV[2] |
| Accelerating voltage | — | 200 V to 30 kV[4] |
| Electron source | — | Schottky field emission gun[2] |
| Detectors | — | In-lens SE and E-T SE detectors[2] |
| Detector (BSE) | — | Robinson backscattered electron detector[4] |
| Stage | — | Fully motorized 6-axis eucentric stage[4] |
| Airlock | — | Integrated 8-inch airlock[4] |
| Maximum wafer loading | — | 4 inch via loadlock, 6 inch via chamber door[2] |
| Operating system | — | Windows 11[4] |
| Software | — | Runs SmartSEM v5[2] |
| Current monitor | — | Integrated current monitor on stage[2] |
| Resolution at 20kV | — | 1nm[2] |
| Max Wafer Diameter (loadlock) | — | 4 inch[2] |
| Max Wafer Diameter (chamber door) | — | 6 inch[2] |
| Control Software (if upgraded) | — | SEMView8000[5] |
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