Waferpedia

Comparison ledger

Surfscan SP 1 ClassicversusSurfscan SP 1 DLS

KLA Surfscan SP 1 Classic, KLA Surfscan SP 1 DLS, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMKLAKLA
Category——
Wafer sizeFor Wafer Centering DeviceFor Wafer Centering Device
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyKLA SurfscanKLA Surfscan
Specifications
ConfigurationUpgraded/New[1]Upgraded/New[2]
Wafer sizeFor Wafer Centering Device[1]For Wafer Centering Device[2]
Defect Sensitivity (Polished Bare Silicon)—0.050 µm[3]
Laser Source—Argon Ion Laser (488 nm)[3]
Wafer Size Support—200 mm and 300 mm[3]
Enhanced Rough Film Sensitivity—Yes[3]
Real Time Defect Classification (RTDC)—Yes[3]
Defect Map and Histogram with Zoom—Yes[3]
Map to Map—Yes[3]
Operator Interface—Yes[3]
Blower Unit—Yes[3]
OEM—KLA-Tencor[3]
Model—SP1 DLS[4]
Wafer Size—200/300mm[3]
Defect Sensitivity—0.050um on polished bare silicon[3]
Surface Type—Unpatterned[3]
Key Feature—Enhanced Rough Film Sensitivity[3]
Optional Handler—300mm Single FOUP/FIMS Handler[3]
Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]classoneequipment.comclassoneequipment.com
  4. [4]Equipment inventory listing