Comparison ledger
Koh Young 2014-09-11T12, Mydata MY 12, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 2014-09-11T12Koh Young | MY 12Mydata |
|---|---|---|
| OEM | Koh Young | Mydata |
| Category | Assembly / SMT | Assembly / SMT |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Koh Young 2014-09-11T12 | Mydata MY 12 |
| Specifications | ||
| Semiconductor Solutions | Listed as one of the company’s business areas[1] | — |
| Configuration | — | 50/60 Hz[2] |
| Type | — | pick and place machine[3] |
| Category | — | Assembly / SMT[3] |
| Power / electrical | — | 50/60 Hz[3] |
| Placement rate, standard performance | — | 6,500 CPH[4] |
| HYDRA Speedmount placement rate on chips | — | 21,000 CPH[4] |
| Linescan Vision System placement rate on fine-pitch components | — | 6,100 CPH[4] |
| Accuracy | — | Repeatability of 15 mm at 3 sigma[4] |
| Feeder capacity | — | 144 x 8 mm tapes or 135 SOIC tubes or 112 x 8 mm tapes and 32 JEDEC trays (with TEX)[4] |
| Rated speed | — | 21,000 CPH IPC 9850 chip net throughput 17,500 CPH[5] |
| Fine-pitch rated speed | — | 6,100 CPH IPC 9850 fine pitch net throughput 1,500 CPH[5] |
| Board handling: maximum board size | — | 384 x 508 mm, 563 x 508 mm, 745 x 610 mm, or 932 x 732 mm depending on configuration[5] |
| Machine size | — | 3360 mm length, 1450 mm height, 2000 mm depth, 2134 mm depth, or 2378 mm depth depending on configuration[5] |
| Weight | — | 2100 kg[5] |
| Power requirements | — | Three phase AC 6.6 kVA (3 x 2.2 kVA)[5] |
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