Waferpedia

Comparison ledger

Asterionversus10490

Kulicke & Soffa Asterion, West Bond 10490, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
AsterionKulicke & Soffa
10490West Bond
OEMKulicke & SoffaWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyKulicke & Soffa AsterionWest Bond 10490
Specifications
Current Rating of Largest Load3 A[1]—
Configuration50/60 Hz[1]—
Inrush CurrentSCCR[1]—
Nominal Operating Voltage (VAC)200, 220, 240[1]—
PhaseSingle Phase[1]—
Frequency50/60 Hz[1]—
Inrush current (SCCR)SCCR[1]—
Vintage2023[1]—
Manufacturer—West Bond[2]
Model—10490[2]
Description—Convertible bonder, wedge to ball[3]
Tool type—Convertible bonder[4]
Bonding modes—Wedge bonding and ball bonding[4]
Use—Wire bonding[4]

Plan your fab

Building a Packaging & Bonding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]Equipment inventory listing
  3. [3]fabsurplus.comfabsurplus.com
  4. [4]waferpedia.comwaferpedia.com