Waferpedia

Comparison ledger

Rapid Automaticversus1 WBS 1 Wafer Substrate

Kulicke & Soffa Rapid Automatic, Logitech 1 WBS 1 Wafer Substrate, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
Rapid AutomaticKulicke & Soffa
OEMKulicke & SoffaLogitech
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyKulicke & Soffa RapidLogitech 1 WBS 1 Wafer Substrate
Cited variants
  • K&S Rapid Automatic Wire Bonder[1]
—
Specifications
Configuration50/60 Hz[2]—
PowerSingle Phase, 50/60 Hz[2]—
Machine TypeAutomatic Wire Bonder[2]—
MakeK&S[2]—
ModelRapid[2]—
TypeAutomatic Wire Bonder[2]—
Electrical configurationSingle Phase, 50/60 Hz[2]—
Wafer Size—6 inch[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]inventory listing
  3. [3]inventory listing
  4. [4]Equipment inventory listing