Comparison ledger
Lam Research 2300 Selis, Oxford Instruments 100 ICP Fluorine, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 2300 SelisLam Research | 100 ICP FluorineOxford Instruments |
|---|---|---|
| OEM | Lam Research | Oxford Instruments |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Lam Research 2300 Selis | Oxford Instruments 100 ICP Fluorine |
| Cited variants |
| — |
| Specifications | ||
| OEM / manufacturer | Lam Research[2] | — |
| Model | 2300 Selis[2] | — |
| Equipment type | Etch chamber[2] | — |
| Category | Etch[3] | — |
| Wafer size | 12 inch[2] | 4 inch, 6 inch, 8 inch (with clamp change)[4] |
| Process / description | Dielectric Etch – Process Chamber[1] | — |
| Configuration | Chamber Only[1] | — |
| Version | 300 mm[1] | — |
| Etch Gases | — | SF6, CF4, O2, Ar, N2, CHF3, C4F8[4] |
| Cryo DRIE etch rate | — | up to 5 µm/min[4] |
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