Waferpedia

Comparison ledger

Exelan Dryversus100 ICP Fluorine

Lam Research Exelan Dry, Oxford Instruments 100 ICP Fluorine, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
Exelan DryLam Research
100 ICP FluorineOxford Instruments
OEMLam ResearchOxford Instruments
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLam Research Exelan DryOxford Instruments 100 ICP Fluorine
Cited variants—
Specifications
Wafer Size300mm[1]—
Vintage (manufacturing year)2005[1]—
Wafer Size (via version)200mm[3]—
Vintage2004-06-01[2]—
ManufacturerLam Research[4]—
ModelExelan Dry[4]—
Tool typedry etch chamber[5]—
Vintage year2005[5]—
Variant designationV2 Exelan[5]—
Variant wafer size200mm[5]—
Variant vintage year2004[5]—
Etch Gases—SF6, CF4, O2, Ar, N2, CHF3, C4F8[6]
Cryo DRIE etch rate—up to 5 µm/min[6]
Wafer size—4 inch, 6 inch, 8 inch (with clamp change)[6]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]csisemi.comcsisemi.com
  2. [2]fabsurplus.comfabsurplus.com
  3. [3]fabsurplus.comfabsurplus.com
  4. [4]Equipment inventory listing
  5. [5]waferpedia.comwaferpedia.com
  6. [6]nanofab.utah.edunanofab.utah.edu