Waferpedia

Comparison ledger

IPEC 372 Mversus100R16

Lam Research IPEC 372 M, Strasbaugh 100R16, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
IPEC 372 MLam Research
100R16Strasbaugh
OEMLam ResearchStrasbaugh
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLam Research IPEC 372 MStrasbaugh 100R16
Specifications
CategoryCMP[1]—
Wafer Size8 inch (200 mm)[1]—
TypeAutomated Wafer Polishing System[2]—
OEMLam Research[1]—
ModelIPEC 372 M[3]—
Wafer sizes8 inch[3]—
Tool typeAutomated wafer polishing system[1]—
Also referred to asIPEC 372M Avanti[1]—
type—1 spindle grinder/polisher[4]
drive system—DC drive system with 2 motors[4]
spindle RPM—1-180 RPM[4]
eccentric RPM—1-90 RPM[4]
controls—digital timer; air down switch; spindle and eccentric speed dials; air regulators[4]
capacity—16 inches[4]
spindle size—1-8 TPI[4]
overall dimensions—28 inches x 36 inches x 48 inches[4]
weight—500 lbs[4]
origin—made in the USA[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]semistarcorp.comsemistarcorp.com
  3. [3]Equipment inventory listing
  4. [4]excelltechnology.comexcelltechnology.com