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Comparison ledger

15 LapperversusWG6

Lapmaster 15 Lapper, Logitech WG6, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
15 LapperLapmaster
WG6Logitech
OEMLapmasterLogitech
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system—GUI
Generation——
FamilyLapmaster 15Logitech WG6
Specifications
Number Of Conditioning RingsUp to 3[1]—
Ring IDUp to 5.5″[1]—
Plate Diameter – Outside15″[1]—
Plate Diameter – Inside3 1/2″[1]—
Standard RPM60[1]—
Drive Motor1/2 HP[1]—
Electrics110V / 1Ph / 60Hz[1]—
Dimensions – Approximate26″(L-R) x 21″(F-B) x 22″(H)[1]—
ConfigurationEquipped with:[1]—
Equipped with: 15″ Cast Iron PlateIncluded[1]—
Equipped with: (3) Yoke/Roller Bearing AssembliesIncluded[1]—
Equipped with: (3) Conditioning RingsIncluded[1]—
Equipped with: (3) Hold DownsIncluded[1]—
Equipped with: 30 Minute TimerIncluded[1]—
System composition—PM6 or LP70 precision polishing machine plus WG6 polishing head[2]
Batch capacity—Up to 6 samples at one time[2]
LP70 capacity with two WG6 heads—Up to 12 specimens at one time[2]
Polishing head speed—Up to 35 rpm[2]
Incremental load per drive rod—Up to 1.4 kg on each individual drive rod[2]
Drive rods—Six drive rods[2]
Motor—Powerful, low voltage DC motor[2]
Material—Corrosion resistant materials[2]
Large specimen example size—76 x 51 mm[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]web.archive.orgweb.archive.org