Comparison ledger
Lapmaster 15, Takatori MWS-SiC12F, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 15Lapmaster | MWS-SiC12FTakatori |
|---|---|---|
| OEM | Lapmaster | Takatori |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Lapmaster 15 | Takatori MWS-SiC12F |
| Cited variants | — |
|
| Specifications | ||
| Input Power | 110 Vac[2] | — |
| Plate Diameter | 15 inches (381 mm)[3] | — |
| Number of Conditioning Rings | 3[3] | — |
| Ring ID | 5.5 inches (140 mm)[3] | — |
| Standard RPM | 60[3] | — |
| RPM Range (Variable Speed Drive) | 0-60[3] | — |
| Drive Motor - Lapper | 0.5 HP (0.37 kW)[3] | — |
| Drive Motor - Polisher | 0.75 HP (0.56 kW)[3] | — |
| Length | 25 inches (635 mm)[3] | — |
| Width | 20 inches (508 mm)[3] | — |
| Height | 24 inches (610 mm)[3] | — |
| Estimated Shipping Weight | 285 lbs (129.3 kg)[3] | — |
| Product line | — | MWS (Multi Wire Saw)[1] |
| Machine type | — | multi wire saw[1] |
| Capable materials | — | SiC, GaN, LT, LN, ALN, SiN, Ga2O3, Sapphire, Crystal, GaAs, GaP, InP, Neodymium magnet, Ceramics, Resin, Metal, Platinum, Silver, Gold and other hard brittle material[1] |
| Variable processing conditions | — | thin wire, high wire tension, fast wire running, extra-long time slicing process[1] |
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