Waferpedia

Comparison ledger

1 WBS 1 Wafer SubstrateversusH1/HVM1

Logitech 1 WBS 1 Wafer Substrate, MRSI H1/HVM1, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMLogitechMRSI
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLogitech 1 WBS 1 Wafer SubstrateMRSI H1/HVM1
Cited variants—
Specifications
Wafer Size6 inch[2]—
precision class—1-micron[1]
machine family—H1/HVM1[1]

Plan your fab

Building a Packaging & Bonding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (2)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]Equipment inventory listing