Comparison ledger
Logitech 1 WBS 1 Wafer Substrate, Shinkawa UTC 1000, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1 WBS 1 Wafer SubstrateLogitech | UTC 1000Shinkawa |
|---|---|---|
| OEM | Logitech | Shinkawa |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | 2005 Vintage |
| Control system | — | — |
| Generation | — | — |
| Family | Logitech 1 WBS 1 Wafer Substrate | Shinkawa UTC |
| Specifications | ||
| Wafer Size | 6 inch[1] | — |
| Bonding Method | — | Ultrasonic Thermo Compression[2] |
| Machine Accuracy | — | +/- 2.5 µm (+/- 3.3 µm for multi-bonding setting)[2] |
| Bonding Speed | — | 67 ms / 2 mm Wire (With Loop Control)[2] |
| Bonding Wire Length | — | Max. 8 mm[2] |
| Number of Bonding Wires | — | 8000 Wires[2] |
| Loader / Unloader | — | Magazine Stacker Type[2] |
| Indexer | — | Center-Parting Type Universal Indexer[2] |
| Power Supply | — | AC 100 V +/- 5 % 50/60 Hz[2] |
| Power Consumption | — | Approx. 1000 W[2] |
| Compressed Air | — | 500 kPa {5 kgf / cm²} 60 I / min[2] |
| Vacuum pressure | — | -74 kPa (-550 mmHg) or less (Gauge Pressure)[2] |
| Dimensions & Mass | — | 1080 W x 950 D x 1940 H mm , Approx. 590 kg[2] |
| Configuration | — | Pattern Recognition Unit:[2] |
| Detection Method | — | Gray Scale Correlation[2] |
| Detection Speed | — | 0.11 s Max,. / 2 Point Alignment (including move time)[2] |
| Lead Side | — | MAx. X: +/- 1.26 mm, Y: +/- 0.86 mm[2] |
| Die Side | — | Max. X: +/- 0.31 mm, Y: +/- 0.21 mm[2] |
| Bonding Area | — | X: +/- 28 mm, Y: +/- 33 mm[2] |
| Machine Accuracy (single bond) | — | ±2.5 µm[2] |
| Machine Accuracy (multi-bonding) | — | ±3.3 µm[2] |
| Max Bonding Wire Length | — | 8 mm[2] |
| Loader/Unloader Type | — | Magazine Stacker Type[2] |
| Indexer Type | — | Center-Parting Type Universal Indexer[2] |
| Dimensions (W x D x H) | — | 1080 x 950 x 1940 mm[2] |
| Mass | — | Approx. 590 kg[2] |
| Pattern Recognition Detection Method | — | Gray Scale Correlation[2] |
| Pattern Recognition Detection Speed | — | 0.11 s max for 2-point alignment (including move time)[2] |
| Detection Area (Lead Side) | — | Max X: ±1.26 mm, Y: ±0.86 mm[2] |
| Detection Area (Die Side) | — | Max X: ±0.31 mm, Y: ±0.21 mm[2] |
| Wire Diameter (Gold Wire) | — | Ø15–38 µm, 2-inch double flange spool[2] |
| Applicable Lead Frame Width | — | 20–80 mm[2] |
| Applicable Lead Frame Length | — | 95–262 mm[2] |
| Applicable Lead Frame Thickness | — | 0.07–0.3 mm[2] |
| Gold Wire | — | Ø 15 ~ 38 µm[2] |
| Width | — | 20 ~ 80 mm[2] |
| Length | — | 95 ~ 262 mm[2] |
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