Comparison ledger
Logitech 1 WBS 1 Wafer Substrate, West Bond 7374E, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1 WBS 1 Wafer SubstrateLogitech | 7374EWest Bond |
|---|---|---|
| OEM | Logitech | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Logitech 1 WBS 1 Wafer Substrate | West Bond 7374E |
| Specifications | ||
| Wafer Size | 6 inch[1] | — |
| Series | — | 7372E / 7367E / 7374E Series[2] |
| Type | — | Manual Die Bonder[2] |
| Configuration | — | Dual-head[2] |
| Construction | — | Gantry construction[2] |
| Motion | — | Orthogonal motions rather than pivoted[2] |
| Axis brakes | — | Individual axis brakes; X, Y, and Z axes can be braked pneumatically on signal[2] |
| Protection | — | ESD protection included[2] |
Plan your fab
Building a Packaging & Bonding process? Get a complete equipment list.
Open the fab equipment planner →