Waferpedia

Comparison ledger

505versus10490

MRSI 505, West Bond 10490, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
505MRSI
10490West Bond
OEMMRSIWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyMRSI 505West Bond 10490
Specifications
X-Y Resolution0.5 micron[1]—
Platform MaterialSolid Granite Overhead and Base Platform[1]—
X-Y Axis MotorsTwo Linear Anarad DC Motors with Glass Encoders[1]—
Z Axis MotorOne Brushless Ball Screw Drive Motor[1]—
Camera SystemThree Dual Magnification IR Cameras with Programmable Lighting; Look-up Camera for Flip Chip[1]—
Inspection StationBottom mounted camera[1]—
ControllerRack Mount Industrial Computer[1]—
Vacuum SystemVacuum Surface Pick Up Valves, Meter & Tubing[1]—
Work SurfaceLarge work surface accommodates most input and output options[1]—
Manufacturer—West Bond[2]
Model—10490[2]
Description—Convertible bonder, wedge to ball[3]
Tool type—Convertible bonder[4]
Bonding modes—Wedge bonding and ball bonding[4]
Use—Wire bonding[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]gtsaz.comgtsaz.com
  2. [2]Equipment inventory listing
  3. [3]fabsurplus.comfabsurplus.com
  4. [4]waferpedia.comwaferpedia.com