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Comparison ledger

HR 8500 III TW UV Detaperversus003163-000 SRD

Nitto HR 8500 III TW UV Detaper, Semitool 003163-000 SRD, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMNittoSemitool
CategoryWet Processing / CleanWet Processing / Clean
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyNitto HR 8500 III TW UV DetaperSemitool 003163-000 SRD
Specifications
Control MethodOne Board Micro Computer[1]—
Wafer Transfer Robot3-axis type[1]—
ConfigurationInstallation Environment:[1]—
Temperature25 ± 5 degrees C[1]—
Humidity45 ± 15%[1]—
OthersClean level ; Class 1,000 or more (Place where it will be subjected to direct sunlight)[1]—
Power1.5 kVA[1]—
For AirRc 3/8 screw[1]—
Lug with grounding linw (Cable LengthApprox. 5m)[1]—
OEMNitto Denko[1]—
ModelHR 8500 III TW UV[1]003163-000[2]
Wafer Sizes8 inch[1]—
Clean levelClass 1,000 or more[1]—
Power SupplySingle Phase; AC 100 V ± 5%; 1.5 kVA; 50/60 Hz[1]—
Air SupplyDry Air; 0.5 MPa or more; 250 NL/min or more[1]—
Connection PortFor electrical power; For Air: Rc 3/8 screw; Lug with grounding linw (Cable Length: Approx. 5m)[1]—
Make—Semitool[2]
Equipment type—Spin Rinse Dryer (SRD)[2]
Asset #—139375[2]
Last Confirm Date—September 03, 2025[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]Equipment inventory listing