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Comparison ledger

806versusEBPG5200

OAI 806, Raith EBPG5200, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
806OAI
OEMOAIRaith
CategoryLithographyLithography
Wafer size6"6"
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyOAI 806Raith EBPG5200
Cited variants—
Specifications
ModelOAI 806 Mask Aligner[2]—
Patterning substrate sizeup to 6 inches[2]—
Contact modessoft, hard, and proximity contact modes[2]—
Alignment accuracysubmicron[2]—
UV sourcecollimated UV light source[2]—
Workholdingvacuum chuck[2]—
Opticsintegrated microscope optics[2]—
Stagemotorized stage[2]6" full travel[3]
Optional capabilitybackside alignment[2]—
Substrate sizeup to 6 inches[2]—
Light sourcecollimated UV[2]—
Backside alignmentoptional[2]—
Technology—Direct write lithography / electron beam lithography[3]
Platform—Universal plinth platform shared with EBPG5150[3]
Column technology—EBPG Electron 100 kV[3]
Pattern generator—125 MHz[3]
Beam current—Up to 350 nA[3]
Overlay accuracy—≤ 5 nm[3]
Minimum feature size—Less than 8 nm[3]
Acceleration voltages—20, 50 and 100 kV[3]
Large field size—Continuously variable up to 1 mm at all kVs[3]
Sample handling—Automatic 2 holder as standard; 10 holder optional[3]
Wafer size—6"[4]
Acceleration voltage—100 kV[1]
Maximum current—350 nA[1]
Mainfield size—1 mm[1]
Minimum linewidth—<8 nm[1]
Beam current range—100 pA to 250 nA[5]
Beam step frequency—500 Hz to 125 MHz[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]wiki.nano.upenn.eduwiki.nano.upenn.edu
  2. [2]colorado.educolorado.edu
  3. [3]web.archive.orgweb.archive.org
  4. [4]waferpedia.comwaferpedia.com
  5. [5]nanolabnl.nlnanolabnl.nl