Comparison ledger
Oxford Instruments 100 ICP Fluorine, SPTS MACS ICP, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 100 ICP FluorineOxford Instruments | MACS ICPSPTS |
|---|---|---|
| OEM | Oxford Instruments | SPTS |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Oxford Instruments 100 ICP Fluorine | SPTS MACS ICP |
| Cited variants | — |
|
| Specifications | ||
| Etch Gases | SF6, CF4, O2, Ar, N2, CHF3, C4F8[2] | — |
| Cryo DRIE etch rate | up to 5 µm/min[2] | — |
| Wafer size | 4 inch, 6 inch, 8 inch (with clamp change)[2] | 8 inch[3] |
| Configuration | — | HR chamber[3] |
| Clamp type | — | standard WTC[3] |
| Coil RF power | — | Advanced Energy RFG3001, 3kw[3] |
| Platen RF power | — | ENI ACG-3B 13.56MHZ, 300w[3] |
| Load lock pump | — | Ebara AAL10[3] |
| Chamber pump | — | Ebara A30W[3] |
| Turbo pump | — | Leybold MAG2000CT[3] |
| Turbo Pump Controller | — | Leybold MAG Drive 2000[3] |
| Chiller | — | ATS/DEX-20ADI[3] |
| Manufacturer | — | SPTS / STS[3] |
| Model | — | MACS ICP[3] |
| Category | — | Etch[4] |
| Chamber | — | HR chamber[3] |
| Wafer capability | — | 6", 8" capable[3] |
| Wafer handling | — | MACS loader for cassette to cassette operation (2 load stations)[3] |
| Vacuum load lock | — | Carousel vacuum load lock[3] |
| Backside cooling | — | Helium backside cooling (HBC)[3] |
| Gases | — | C4F8 (200 sccm); SF6 (1000 sccm); O2 (200 sccm); Ar (50 sccm)[3] |
| Vintage | — | 2002[3] |
| Voltage | — | 208 Volts / 60 Hz, 40 Amps/phase[1] |
| Chamber quantity | — | 1 chamber[5] |
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