Waferpedia

Comparison ledger

100 ICP FluorineversusTE 8401 Poly

Oxford Instruments 100 ICP Fluorine, Tokyo Electron TE 8401 Poly, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
100 ICP FluorineOxford Instruments
TE 8401 PolyTokyo Electron
OEMOxford InstrumentsTokyo Electron
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyOxford Instruments 100 ICP FluorineTokyo Electron TE 8401
Cited variants—
  • TE 8401 (poly etch configuration)[1]
  • TE 8401 (nitride etch configuration)[1]
Specifications
Etch GasesSF6, CF4, O2, Ar, N2, CHF3, C4F8[2]—
Cryo DRIE etch rateup to 5 µm/min[2]—
Wafer size4 inch, 6 inch, 8 inch (with clamp change)[2]8-inch wafers[1]
Configuration—Single chamber[3]
LD—2 each[3]
Gas—He, O2, CF4, HBr, CL2[3]
OS—EPROM based system[3]
Manufacturer—Tokyo Electron[3]
Model—TE 8401 Poly[3]
Pumps—2[3]
Gas delivery—He, O2, CF4, HBr, CL2[3]
Vintage—1998[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]nanofab.utah.edunanofab.utah.edu
  3. [3]inventory listing