Comparison ledger
Plasma-Therm SLR-770, Tegal 1511e, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | SLR-770Plasma-Therm | 1511eTegal |
|---|---|---|
| OEM | Plasma-Therm | Tegal |
| Category | Etch | Etch |
| Wafer size | 2" | three- to six-inch wafers |
| Process node | — | — |
| Introduced | — | 1984 |
| Production run | — | 1984– |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Plasma-Therm SLR 770 | Tegal 1511e |
| Specifications | ||
| System type | Shuttle lock ICP inductively coupled plasma etch system[1] | — |
| Controller | PC controller[1] | — |
| Load lock | Vacuum load lock with wafer transfer robot[1] | — |
| Wafer size capability | Can process wafers from 2" to 8" depending on which process kit is installed[1] | — |
| Current configuration | Currently configured with 3" kit[1] | — |
| Thermal transfer | Thermal transfer module for effective cooling of substrate utilizing helium backside thermal transfer in conjunction with computer controlled substrate clamping[1] | — |
| Plasma source | High frequency RF-based inductively coupled plasma source capable of high density plasma generation[1] | — |
| Pressure control | Closed loop pressure control[1] | — |
| Pumping | Turbo pump with roughing pump[1] | — |
| Gas controllers | Total of eight MFC gas controllers[1] | — |
| Previously used gases | N2, O2, CHF3, AR, CH4, CL2, BCL3, CF4[1] | — |
| Included accessory | Water chiller[1] | — |
| tool type | — | tri-electrode dual-frequency plasma etch system[2] |
| wafer size | — | three- to six-inch wafers[2] |
| first sold | — | 1984[2] |
| system characteristic | — | first vacuum-loadlocked dual-frequency tri-electrode etch system[2] |
| First vacuum-loadlocked dual-frequency tri-electrode etch system | — | Yes[2] |
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