Waferpedia

Comparison ledger

6 DG Lapperversus100R16

PR Hoffman 6 DG Lapper, Strasbaugh 100R16, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
6 DG LapperPR Hoffman
100R16Strasbaugh
OEMPR HoffmanStrasbaugh
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyPR Hoffman 6 DG LapperStrasbaugh 100R16
Specifications
Configuration66t with lift[1]—
type—1 spindle grinder/polisher[2]
drive system—DC drive system with 2 motors[2]
spindle RPM—1-180 RPM[2]
eccentric RPM—1-90 RPM[2]
controls—digital timer; air down switch; spindle and eccentric speed dials; air regulators[2]
capacity—16 inches[2]
spindle size—1-8 TPI[2]
overall dimensions—28 inches x 36 inches x 48 inches[2]
weight—500 lbs[2]
origin—made in the USA[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]excelltechnology.comexcelltechnology.com