Waferpedia

Comparison ledger

UTC 2000 Superversus10100

Shinkawa UTC 2000 Super, West Bond 10100, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
10100West Bond
OEMShinkawaWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyShinkawa UTC 2000 SuperWest Bond 10100
Specifications
ManufacturerShinkawa[1]—
ModelUTC 2000 Super[1]—
DescriptionWire bonder[2]—
CategoryPackaging & Bonding[3]—
Vintage2007[2]—
ConditionWorking[4]—
ConfigurationPlease Contact Us (Click)[2]—
OEMShinkawa[1]—
Equipment typeWire bonder[1]—
Serial NoPlease Contact Us[2]—

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Sources (4)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]asesemiconductor.comasesemiconductor.com
  3. [3]waferpedia.comwaferpedia.com
  4. [4]dynamicmos.comdynamicmos.com